#Hui Zhu


Substrate thinning and external stress effect on the output characteristics of AlGaN/GaN HEMTs

Novel Semiconductor Devices and Reliability Lab , 北京工业大学

Fatigue behavior of resistive switching in a BiFeO3 thin film

Novel Semiconductor Devices and Reliability Lab , 北京工业大学

A current transient method for trap analysis in BiFeO3 thin films

Novel Semiconductor Devices and Reliability Lab , 北京工业大学

Effect of substrate thinning on the electronic transport characteristics of AlGaN/GaN HEMTs

Novel Semiconductor Devices and Reliability Lab , 北京工业大学

Junction Temperature Measurement Method for Power mosfets Using Turn-On Delay of Impulse Signal

Novel Semiconductor Devices and Reliability Lab , 北京工业大学

Study of Heat Transport Behavior in GaN-Based Transistors by Schottky Characteristics Method

Novel Semiconductor Devices and Reliability Lab , 北京工业大学

Effect of poling process on resistive switching in Au/BiFeO3/SrRuO3 structures

Novel Semiconductor Devices and Reliability Lab , 北京工业大学

Working Thermal Stresses in AlGaAs/GaAs High-Power Laser Diode Bars Using Infrared Thermography

Novel Semiconductor Devices and Reliability Lab , 北京工业大学

Self-heating and traps effects on the drain transient response of AlGaN/GaN HEMTs

Novel Semiconductor Devices and Reliability Lab , 北京工业大学

Cycled Thermomechanical Failure in 808-nm High-Power AlGaAs/GaAs Laser Diode Bars

Novel Semiconductor Devices and Reliability Lab , 北京工业大学

Determining Drain Current Characteristics and Channel Temperature Rise in GaN HEMTs

Novel Semiconductor Devices and Reliability Lab , 北京工业大学

Two-dimensional transient simulations of the self-heating effects in GaN-based HEMTs

Novel Semiconductor Devices and Reliability Lab , 北京工业大学

The channel temperature dependence of drain transient response in AlGaN/GaN HEMTs

Novel Semiconductor Devices and Reliability Lab , 北京工业大学

Identifying the failure mechanism in accelerated life tests by two-parameter lognormal distributions

Novel Semiconductor Devices and Reliability Lab , 北京工业大学

Thermal Fatigue Characteristics of Die Attach Materials for Packaged High-Brightness LEDs

Novel Semiconductor Devices and Reliability Lab , 北京工业大学

A Novel Method for Measuring the Temperature in the Active Region of Semiconductor Modules

Novel Semiconductor Devices and Reliability Lab , 北京工业大学

Determination of Thermal Fatigue Delamination of Die Attach Materials for High-Brightness LEDs

Novel Semiconductor Devices and Reliability Lab , 北京工业大学

Study of traps in low-temperature polysilicon thin film transistors using a current transient method

Novel Semiconductor Devices and Reliability Lab , 北京工业大学

Effect of Self-Heating on the Drain Current Transient Response in AlGaN/GaN HEMTs

Novel Semiconductor Devices and Reliability Lab , 北京工业大学

The thermal properties of AlGaAs/GaAs laser diode bars analyzed by the transient thermal technique

Novel Semiconductor Devices and Reliability Lab , 北京工业大学

Research on the Wake-up Effect of Ferroelectric HfO2-ZrO2 Thin Films

Novel Semiconductor Devices and Reliability Lab , 北京工业大学