Congratulations to the Successful Meeting of “Key Technology and Application of Non-destructive Testing of Semiconductor Device Junction Temperature and Electronic System Thermal Resistance——Scientific and Technological Achievement Appraisal”
29.07.2019
Thanks for the time of review experts. The results have been recognized as internationally advanced, and a part as internationally leading. The measuring techniques will be definitely continued improving!
Graduation trip in 2019（MiYun, Beijing）
27.07.2019
Graduation trip in 2018（FangShan, Beijing）
27.07.2019