array(2) { ["lab"]=> string(3) "859" ["news"]=> string(3) "490" } Congratulations to the Successful Meeting of “Key Technology and Application of Non-destructive Testing of Semiconductor Device Junction Temperature and Electronic System Thermal Resistance——Scientific and Technological Achievement Appraisal” - Novel Semiconductor Devices and Reliability Lab | LabXing

Novel Semiconductor Devices and Reliability Lab

简介 A semiconductor group in BJUT

大学 北京工业大学 / 信息学部
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Congratulations to the Successful Meeting of “Key Technology and Application of Non-destructive Testing of Semiconductor Device Junction Temperature and Electronic System Thermal Resistance——Scientific and Technological Achievement Appraisal”

Thanks for the time of review experts. The results have been recognized as internationally advanced, and a part as internationally leading. The measuring techniques will be definitely continued improving!

创建: Jul 29, 2019 | 15:32
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