Thermal Analysis of the Multi-Chip Vertical Packaged White LED - Novel Semiconductor Devices and Reliability Lab | LabXing

array(2) { ["lab"]=> string(3) "859" ["publication"]=> string(4) "6287" } Thermal Analysis of the Multi-Chip Vertical Packaged White LED - Novel Semiconductor Devices and Reliability Lab | LabXing

Novel Semiconductor Devices and Reliability Lab

简介 A semiconductor group in BJUT

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Thermal Analysis of the Multi-Chip Vertical Packaged White LED

2009

会议 2009 Symposium on Photonics and Optoelectronics

作者 Guangchen Zhang · Shiwei Feng · Lu Wang · Chunsheng Guo · Xuesong Xie · Chenning Ge

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IEEE eXpress Conference Publishing
ISBN: 9781424444120
DOI: 10.1109/sopo.2009.5230158

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