array(2) { ["lab"]=> string(3) "859" ["publication"]=> string(4) "6262" } The thermal characterization of packaged semiconductor device - Novel Semiconductor Devices and Reliability Lab | LabXing

Novel Semiconductor Devices and Reliability Lab

简介 A semiconductor group in BJUT

大学 北京工业大学 / 信息学部
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The thermal characterization of packaged semiconductor device

2019
会议 Sixteenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium (Cat. No.00CH37068)
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