array(2) { ["lab"]=> string(3) "859" ["publication"]=> string(4) "6223" } Temperature distribution measurement for chips based on FPGA - Novel Semiconductor Devices and Reliability Lab | LabXing

Novel Semiconductor Devices and Reliability Lab

简介 A semiconductor group in BJUT

大学 北京工业大学 / 信息学部
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Temperature distribution measurement for chips based on FPGA

2018
会议 2018 14th IEEE International Conference on Solid-State and Integrated Circuit Technology (ICSICT)
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