array(2) { ["lab"]=> string(3) "859" ["publication"]=> string(5) "14597" } Reliability of solder joints in High-power LED package in power cycling tests - Novel Semiconductor Devices and Reliability Lab | LabXing

Novel Semiconductor Devices and Reliability Lab

简介 A semiconductor group in BJUT

大学 北京工业大学 / 信息学部
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Reliability of solder joints in High-power LED package in power cycling tests

2010
会议 2010 10th IEEE International Conference on Solid-State and Integrated Circuit Technology
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