array(2) { ["lab"]=> string(3) "859" ["publication"]=> string(5) "14479" } Implementation of Fast Measurement System of Semiconductor Device Parameter Temperature Coefficient Based on FPGA - Novel Semiconductor Devices and Reliability Lab | LabXing

Novel Semiconductor Devices and Reliability Lab

简介 A semiconductor group in BJUT

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Implementation of Fast Measurement System of Semiconductor Device Parameter Temperature Coefficient Based on FPGA

2022
期刊 Journal of Physics: Conference Series
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Abstract In this paper, a fast temperature coefficient measurement system based on FPGA is presented to rapidly measure the temperature coefficient of semiconductor device parameters. The design methods of hardware circuit, software system and FPGA program are put forward here. The system uses the heating platform to linearly raise the temperature of the device, and collects the voltage and temperature information in real time. Through the integration and processing of a large number of data, the temperature coefficient of DUT can be obtained rapidly and accurately. Based on this system, the silicon-based Schottky barrier diode (Si SBD) is studied, and the diode temperature coefficient is obtained. Compared with the steady-state method to verify the rapidity, accuracy and efficiency of the system. It can be used in the field of electrical and thermal measurement of semiconductor devices.