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#Dong Shi
Junction Temperature Measurement Method for Power mosfets Using Turn-On Delay of Impulse Signal
Novel Semiconductor Devices and Reliability Lab , 北京工业大学
Thermal time-constant spectrum extraction method in AlGaN/GaN HEMTs
Novel Semiconductor Devices and Reliability Lab , 北京工业大学
The research on temperature distribution of GaN-based blue laser diode
Novel Semiconductor Devices and Reliability Lab , 北京工业大学
Thermal investigation of LED array with multiple packages based on the superposition method
Novel Semiconductor Devices and Reliability Lab , 北京工业大学
Rapid test method for thermal characteristics of semiconductor devices
Novel Semiconductor Devices and Reliability Lab , 北京工业大学
Thermal analysis of multiple light sources based on the superposition method
Novel Semiconductor Devices and Reliability Lab , 北京工业大学