Novel Semiconductor Devices and Reliability Lab

Low-cost reconfigurable temperature sensor array on field programmable gate array

2021

会议 2021 4th International Conference on Electron Device and Mechanical Engineering (ICEDME)

作者 Sheng Wang · Shiwei Feng · Chaoxu Hu

Multi-physics field coupling simulation modeling and analysis of StakPak insulated gate bipolar transistor device

2021

会议 2021 4th International Conference on Electron Device and Mechanical Engineering (ICEDME)

作者 Yunong Liu · Chunsheng Guo · Hao Guo · Lei Wei

Nondestructive Measurement for Front Facet Temperature of Semiconductor Lasers

2021

期刊 Journal of Physics: Conference Series

作者 Yijia Ni · Shiwei Feng · Xaozhuang Lu · Kun Bai · Yamin Zhang · Shijie Pan · Xuan Li

Non-destructive peak junction temperature measurement of double-chip IGBT modules with temperature inhomogeneity

2021

期刊 Journal of Physics: Conference Series

作者 Lei Wei · Chunsheng Guo · Hao Guo · Yunong Liu · Shiwei Zhang

Non-destructive testing of heteromorphic workpiece brazing layer quality based on heat conduction

2021

会议 2021 4th International Conference on Electron Device and Mechanical Engineering (ICEDME)

作者 Chaoxu Hu · Shiwei Feng · Xin He · Kun Bai · Sheng Wang

Research on the Wake-up Effect of Ferroelectric HfO2-ZrO2 Thin Films

2021

期刊 Journal of Physics: Conference Series

作者 Rui Li · Hui Zhu · Jie Liu · Si Wang · Na Xie · Zeng Huang · Zhixuan Fang

Study of traps in low-temperature polysilicon thin film transistors using a current transient method

2021

期刊 Semiconductor Science and Technology

作者 Hui Zhu · Na Xie · Si Wang · Zeng Huang · Zhixuan Fang · Zheng Liu · Dong Li · Shiwei Feng · Chunsheng Guo · Yamin Zhang · Lixing Zhou · Bo Liu

A Drain–Source Connection Technique: Thermal Resistance Measurement Method for GaN HEMTs Using TSEP at High Voltage

2020

期刊 IEEE Transactions on Electron Devices

作者 Xuan Li · Shiwei Feng · Chang Liu · Yamin Zhang · Kun Bai · Yuxuan Xiao · Xiang Zheng · Xin He · Shijie Pan · Gang Lin · Lin Bai

Effect of Surface Roughness on Thermal Contact Resistance of Fixed Interface in Thermal Measurement of Electron Device

2020

会议 2020 3rd International Conference on Electron Device and Mechanical Engineering (ICEDME)

作者 Yuzheng Chen · Shiwei Feng · Yamin Zhang · Xin He · Kun Bai · Xuan Li

Effect of Uniaxial Tensile Strains at Different Orientations on the Characteristics of AlGaN/GaN High-Electron-Mobility Transistors

2020

期刊 IEEE Transactions on Electron Devices

作者 Chen Wang · Hui Zhu · Si Wang · Daping Chu · Kai Liu · Lei Jin · Rui Li · Jie Liu · Shiwei Feng · Chunsheng Guo · Yamin Zhang

Measuring Junction Temperature Inhomogeneity of Double-chip IGBT Modules by Electrical Method

2020

会议 2020 3rd International Conference on Electron Device and Mechanical Engineering (ICEDME)

作者 Sijin Wang · Chunsheng Guo · Boyang Liu · Lei Wei · Shiwei Zhang

Monitoring of defects creation sequence in 808 nm laser diode by reflectance analysis

2020

期刊 Microelectronics Reliability

作者 Tieying Hao · Shiwei Feng · Xiang Zheng · Kun Bai

Real-time measurement and control of junction temperature of VDMOS in power cycle test

2020

会议 2020 3rd International Conference on Electron Device and Mechanical Engineering (ICEDME)

作者 Hang Wei · Chunsheng Guo · Hao Guo · Kun Bai · Shiwei Feng

The study of temperature-dependent degradation of optical output on 808 nm GaAs-Based High-Power Laser Diode Bars

2020

会议 2020 3rd International Conference on Electron Device and Mechanical Engineering (ICEDME)

作者 Tieying Hao · Shiwei Feng · Xiang Zheng · Kun Bai

A new method for detecting thermal characteristics of slow-wave structure of helix traveling-wave tube using external heat source

2019

期刊 Review of Scientific Instruments

作者 X. He · S. W. Feng · F. Yang · Y. M. Zhang

A New Method for Measuring Thermal Characteristics of Multistage Depressed Collectors

2019

期刊 IEEE Transactions on Electron Devices

作者 Xin He · Yamin Zhang · Shiwei Feng · Wenjuan Yu · Manpo Yang

A voltage-transient method for characterizing traps in GaN HEMTs

2019

期刊 Microelectronics Reliability

作者 Xiang Zheng · Shiwei Feng · Yifu Gao · Yamin Zhang · Yunpeng Jia · Shijie Pan

Evidence of GaN HEMT Schottky Gate Degradation After Gamma Irradiation

2019

期刊 IEEE Transactions on Electron Devices

作者 Xiang Zheng · Shiwei Feng · Chao Peng · Gang Lin · Lin Bai · Xuan Li · Ying Yang · Shijie Pan · Zhaoxu Hu · Xiaoyang Li · Yamin Zhang

Identifying the Traps in the Channel Region in GaN-based HEMTs Using a Nonmonotone Drain Current Transient

2019

期刊 IEEE Transactions on Device and Materials Reliability

作者 Xiang Zheng · Shiwei Feng · Yamin Zhang · Xuan Li · Kun Bai

Junction Temperature Measurement Method for SiC Bipolar Junction Transistor Using Base-Collector Voltage Drop at Low Current

2019

期刊 IEEE Transactions on Power Electronics

作者 Bangbing Shi · Shiwei Feng · Yamin Zhang · Kun Bai · Yuxuan Xiao · Lei Shi · Hui Zhu · Chunsheng Guo

Photocurrents in GaN-based HEMTs: Theoretical model and experimental results

2019

期刊 Applied Physics Letters

作者 X. Zheng · S. Feng · X. Li · Y Zhang · K. Bai

Temperature distribution measurement based on field-programmable gate array embedded ring oscillators

2019

期刊 Solid-State Electronics

作者 Wenjuan Yu · Shiwei Feng · Yamin Zhang · Bangbing Shi

The thermal characterization of packaged semiconductor device

2019

会议 Sixteenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium (Cat. No.00CH37068)

作者 Shiwei Feng · Xuesong Xie · Changzhi Lu · Guangdi Shen · Guangbo Gao · Xiaoling Zhang

A current-transient method for identifying the spatial positions of traps in GaN-based HEMTs

2018

会议 2018 IEEE International Conference on Electron Devices and Solid State Circuits (EDSSC)

作者 Xiang Zheng · Shiwei Feng · Yamin Zhang

A current transient method for trap analysis in BiFeO3 thin films

2018

期刊 Applied Physics Letters

作者 Hui Zhu · Ying Yang · Xiao Meng · Anquan Jiang · Zilong Bai · Xiang Zheng · Lei Jin · Chen Wang · Shiwei Feng

Bipolar Resistive Switching Effect in BiFeO3/Nb:SrTiO3 Heterostructure by RF Sputtering at Room Temperature

2018

期刊 Journal of Wuhan University of Technology-Mater. Sci. Ed.

作者 Pengfei Wang · Hui Zhu · Yingqiao Zhang · Shiwei Feng · Chunsheng Guo · Yamin Zhang · Xiao Meng · Qiong Qi

Effect of post-deposition annealing pressure on bipolar resistive switching in RF sputtered BiFeO<inf>3</inf>/Nb:SrTiO<inf>3</inf> heterostructure

2018

会议 2018 14th IEEE International Conference on Solid-State and Integrated Circuit Technology (ICSICT)

作者 Ying Yang · Hui Zhu · Xiao Meng · Lei Jin · Chen Wang · Si Wang · Shiwei Feng · Chunsheng Guo · Yamin Zhang

Effect of substrate thinning on the electronic transport characteristics of AlGaN/GaN HEMTs

2018

期刊 Solid-State Electronics

作者 Hui Zhu · Xiao Meng · Xiang Zheng · Ying Yang · Shiwei Feng · Yamin Zhang · Chunsheng Guo

Effect of two-dimensional electron gas on horizontal heat transfer in AlGaN/AlN/GaN heterojunction transistors

2018

期刊 Solid-State Electronics

作者 Xiang Zheng · Shiwei Feng · Yamin Zhang · Yunpeng Jia

Evaluation of the Schottky Contact Degradation on the Temperature Transient Measurements in GaN HEMTs

2018

期刊 IEEE Transactions on Electron Devices

作者 Xiang Zheng · Shiwei Feng · Yamin Zhang · Jingwei Li

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Low-cost reconfigurable temperature sensor array on field programmable gate array

Multi-physics field coupling simulation modeling and analysis of StakPak insulated gate bipolar transistor device

Nondestructive Measurement for Front Facet Temperature of Semiconductor Lasers

Non-destructive peak junction temperature measurement of double-chip IGBT modules with temperature inhomogeneity

Non-destructive testing of heteromorphic workpiece brazing layer quality based on heat conduction

Research on the Wake-up Effect of Ferroelectric HfO2-ZrO2 Thin Films

Study of traps in low-temperature polysilicon thin film transistors using a current transient method

A Drain–Source Connection Technique: Thermal Resistance Measurement Method for GaN HEMTs Using TSEP at High Voltage

Effect of Surface Roughness on Thermal Contact Resistance of Fixed Interface in Thermal Measurement of Electron Device

Effect of Uniaxial Tensile Strains at Different Orientations on the Characteristics of AlGaN/GaN High-Electron-Mobility Transistors

Measuring Junction Temperature Inhomogeneity of Double-chip IGBT Modules by Electrical Method

Monitoring of defects creation sequence in 808 nm laser diode by reflectance analysis

Real-time measurement and control of junction temperature of VDMOS in power cycle test

The study of temperature-dependent degradation of optical output on 808 nm GaAs-Based High-Power Laser Diode Bars

A new method for detecting thermal characteristics of slow-wave structure of helix traveling-wave tube using external heat source

A New Method for Measuring Thermal Characteristics of Multistage Depressed Collectors

A voltage-transient method for characterizing traps in GaN HEMTs

Evidence of GaN HEMT Schottky Gate Degradation After Gamma Irradiation

Identifying the Traps in the Channel Region in GaN-based HEMTs Using a Nonmonotone Drain Current Transient

Junction Temperature Measurement Method for SiC Bipolar Junction Transistor Using Base-Collector Voltage Drop at Low Current

Photocurrents in GaN-based HEMTs: Theoretical model and experimental results

Temperature distribution measurement based on field-programmable gate array embedded ring oscillators

The thermal characterization of packaged semiconductor device

A current-transient method for identifying the spatial positions of traps in GaN-based HEMTs

A current transient method for trap analysis in BiFeO3 thin films

Bipolar Resistive Switching Effect in BiFeO3/Nb:SrTiO3 Heterostructure by RF Sputtering at Room Temperature

Effect of post-deposition annealing pressure on bipolar resistive switching in RF sputtered BiFeO<inf>3</inf>/Nb:SrTiO<inf>3</inf> heterostructure

Effect of substrate thinning on the electronic transport characteristics of AlGaN/GaN HEMTs

Effect of two-dimensional electron gas on horizontal heat transfer in AlGaN/AlN/GaN heterojunction transistors

Evaluation of the Schottky Contact Degradation on the Temperature Transient Measurements in GaN HEMTs