Development of ultra-low capacitance through-silicon-vias (TSVs) with air-gap liner - M.AI.N GROUP | LabXing

array(2) { ["lab"]=> string(3) "126" ["publication"]=> string(4) "1121" } Development of ultra-low capacitance through-silicon-vias (TSVs) with air-gap liner - M.AI.N GROUP | LabXing

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Development of ultra-low capacitance through-silicon-vias (TSVs) with air-gap liner

2013

会议 2013 IEEE 63rd Electronic Components and Technology Conference

作者 Qianwen Chen · Cui Huang · Zheyao Wang

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IEEE
ISBN: 9781479902323
DOI: 10.1109/ectc.2013.6575761

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